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(3,25 mm x 3,25 mm)
TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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HIGH EFFICIENT SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 1.8-A SWITCHES
FEATURES
* * * * * * * * * * * * Up to 96% Efficiency 1200-mA Output Current at 3.3V in Step Down Mode (VIN = 3.6V to 5.5V) Up to 800-mA Output Current at 3.3V in Boost Mode (VIN > 2.4V) Automatic Transition between Step Down and Boost Mode Device Quiescent Current less than 50A Input Voltage Range: 1.8V to 5.5V Fixed and Adjustable Output Voltage Options from 1.2V to 5.5V Power Save Mode for Improved Efficiency at Low Output Power Forced Fixed Frequency Operation and Synchronization possible Load Disconnect During Shutdown Over-Temperature Protection Available in Small 3 mm x 3 mm, QFN-10 Package
APPLICATIONS
* * * * * * All Two-Cell and Three-Cell Alkaline, NiCd or NiMH or Single-Cell Li Battery Powered Products Portable Audio Players PDAs Cellular Phones Personal Medical Products White LEDs
DESCRIPTION
The TPS6300x devices provide a power supply solution for products powered by either a two-cell or three-cell alkaline, NiCd or NiMH battery, or a one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 1200 mA while using a single-cell Li-Ion or Li-Polymer Battery, and discharge it down to 2.5V or lower. The buck-boost converter is based on a fixed frequency, pulse-width-modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low load currents, the converter enters Power Save mode to maintain high efficiency over a wide load current range. The Power Save mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 1800 mA. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the battery. The device is packaged in a 10-pin QFN PowerPADTM package measuring 3 mm x 3 mm (DRC).
L1 2.2H
L1 VIN 1.8V to 5.5V VIN C1 10F VINA EN PS/SYNC GND
L2 VOUT C2 10F VOUT 3.3V up to 1200mA
FB PGND
TPS63001
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright (c) 2006, Texas Instruments Incorporated
TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OUTPUT VOLTAGE OPTIONS (1)
TA OUTPUT VOLTAGE DC/DC Adjustable 40C to 85C 3.3 V 5.0 V (1) (2) PACKAGE MARKING BPT BPU BPV 10-Pin QFN PACKAGE PART NUMBER (2) TPS63000DRC TPS63001DRC TPS63002DRC
Contact the factory to check availability of other fixed output voltage versions. The DRC package is available taped and reeled. Add R suffix to device type (e.g., TPS63000DRCR) to order quantities of 3000 devices per reel. Add T suffix to device type (e.g., TPS63000DRCT) to order quantities of 250 devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
TPS6300x Input voltage range on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB Operating virtual junction temperature range, TJ Storage temperature range Tstg (1) -0.3 V to 7 V -40C to 150C -65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
DISSIPATION RATINGS TABLE
PACKAGE DRC THERMAL RESISTANCE JA 48.7C/W POWER RATING TA 25C 2054 mW DERATING FACTOR ABOVE TA = 25C 21 mW/C
RECOMMENDED OPERATING CONDITIONS
MIN Supply voltage at VIN, VINA Operating free air temperature range, TA Operating virtual junction temperature range, TJ 1.8 -40 -40 NOM MAX UNIT 5.5 85 125 V C C
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25C) (unless otherwise noted)
DC/DC STAGE PARAMETER VI VI VO VFB f ISW Input voltage range Input voltage range for startup TPS63000 output voltage range TPS63000 feedback voltage Oscillator frequency Frequency range for synchronization Switch current limit High side switch on resistance Low side switch on resistance Line regulation Load regulation VIN Iq Quiescent current VINA VOUT (adjustable output voltage) FB input impedance (fixed output voltage) IS VUVLO VIL VIH Shutdown current Under voltage lockout threshold EN, PS/SYNC input low voltage EN, PS/SYNC input high voltage EN, PS/SYNC input current Overtemperature protection Overtemperature hysteresis Clamped on GND or VINA 1.2 0.01 140 20 0.1 VEN = 0 V, VIN = VINA = 3.6 V VLBI voltage decreasing 1.5 CONTROL STAGE 1.7 1.8 0.4 V V V A C C IO = 0 mA, VEN = VIN = VINA = 3.6 V, VOUT = 3.3 V 1 40 4 1 0.1 1 VIN = VINA = 3.6 V, TA = 25C VIN = VINA = 3.6 V VIN = VINA = 3.6 V TEST CONDITIONS MIN 1.8 1.9 1.2 495 1250 1250 1600 1800 100 100 0.5% 0.5% 1.5 50 6 A A A M A 500 TYP MAX 5.5 5.5 5.5 505 1500 1800 2000 UNIT V V V mV kHz kHz mA m m
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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PIN ASSIGNMENTS
DRC PACKAGE (TOP VIEW)
VOUT L2 PGND L1 VIN
FB GND VINA PS/SYNC EN
Terminal Functions
TERMINAL NAME EN FB GND PS/SYNC L1 L2 PGND VIN VOUT VINA PowerPADTM NO. 6 10 9 7 4 2 3 5 1 8 I O I I I I I/O I I Enable input. (1 enabled, 0 disabled) Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions Control / logic ground Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization) Connection for Inductor Connection for Inductor Power ground Supply voltage for power stage Buck-boost converter output Supply voltage for control stage Must be soldered to achieve appropriate power dissipation. Should be connected to PGND. DESCRIPTION
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
FUNCTIONAL BLOCK DIAGRAM (TPS63000)
L1 VIN Current Sensor L2 VOUT
VBAT VOUT
PGND PGND Gate Control _
VINA
Modulator + Oscillator Device Control
+ _ VREF
+ -
FB
PS/SYNC
EN
Temperature Control PGND
PGND
GND
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
DESCRIPTION Maximum output current Efficiency vs Input voltage vs Output current (TPS63001) vs Output current (TPS63002) vs Input voltage (TPS63001) vs Input voltage (TPS63002) Output voltage Waveforms vs Output current (TPS63001) vs Output current (TPS63002) Output voltage in continuous current mode (TPS63001, VIN > VOUT) Output voltage in continuous current mode (TPS63001, VIN < VOUT) Output voltage in continuous current mode (TPS63001, VIN = VOUT) Output voltage in power save mode (TPS63001, VIN > VOUT) Output voltage in power save mode (TPS63001, VIN < VOUT) Load transient response (TPS63001, VIN > VOUT) Load transient response (TPS63001, VIN < VOUT) Line transient response (TPS63001, Iout = 300mA) Line transient response (TPS63001, Iout = 300mA) Startup after enable (TPS63000, VOUT = 2.5V) Startup after enable (TPS63002) FIGURE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE
1800 1600 TPS63000, VO = 1.8 V 100 90 80 70
EFFICIENCY vs OUTPUT CURRENT (TPS63001)
IO - maximum output current - mA
1400
VI = 2.4 V VI = 3.6 V VI = 4.2 V
Efficiency - %
1200 1000 800 600 400 200 0 1.8 TPS63001, VO = 3.3 V TPS63002, VO = 5 V
60 50 40 30 20 10 0 0.001
TPS63001 VO = 3.3 V
2.6
4.2 3.4 VI - Input Voltage - V
5
0.01
0.1
1
I O - Output Current - A
Figure 1. EFFICIENCY vs OUTPUT CURRENT (TPS63002)
100 VI = 3.6 V 90 80 70 95 90 85 VI = 4.2 V 100
Figure 2. EFFICIENCY vs INPUT CURRENT (TPS63001)
IO = 500 mA
Efficiency - %
60 50 40 30 20 10 0 0.001
Efficiency - %
VI = 2.4 V
IO = 100 mA
80 75 70 65 60
IO = 10 mA
TPS63002 VO = 5 V 0.1 0.01 IO - Output Current - A 1
55 50 1.8 2.3 2.8 3.3 3.8
TPS63001 VO = 3.3 V
4.3 4.8 5.3
VI - input voltage - V
Figure 3.
Figure 4.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
EFFICIENCY vs INPUT CURRENT (TPS63002)
100 95 90 3.350 IO = 500 mA 3.400
OUTPUT VOLTAGE vs OUTPUT CURRENT (TPS63001)
TPS63001 VO = 3.3 V
80 75 70 65 60 55 50 1.8 2.3 2.8 TPS63002 VO = 5 V 3.3 3.8 4.3 VI - Input Voltage - V 4.8 5.3 IO = 10 mA IO = 100 mA
VO - Output Voltage - V
85
Efficiency - %
3.300
VI = 3.6 V
3.250
3.200 0.001
0.1 IO - Output Current - A
0.01
1
Figure 5. OUTPUT VOLTAGE vs OUTPUT CURRENT (TPS63002)
5.150 TPS63002 VO = 5 V 5.100
Figure 6.
VO - Output Voltage - V
5.050 VI = 3.6 V 5
4.950
4.900
4.850 0.001
0.01 0.1 IO - Output Current - A
1
Figure 7.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN > VOUT)
Output Voltage 10 mV/div L1 Voltage 5 V/div L2 Voltage 5 V/div
OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN > VOUT)
Output Voltage 10 mV/div
L1 Voltage 5 V/div L2 Voltage 5 V/div
Inductor Current 500 mA/div TPS63001 VO = 3.3 V VI = 4.2 V, IO = 500 mA Timebase 500 ns/div TPS63001, VO = 3.3 V VI = 2.4 V, IO = 500 mA
Inductor Current 500 mA/div
Timebase 500 ns/Div
Figure 8. OUTPUT VOLTAGE IN CONTINUOUS CURRENT MODE (TPS63001, VIN = VOUT)
Output Voltage 10 mV/div
Figure 9. OUTPUT VOLTAGE IN POWER SAVE MODE (TPS63001, VIN > VOUT)
L1 Voltage 5 V/div L2 Voltage 5 V/div
Output Voltage 100 mV/div
Inductor Current 500 mA/div TPS63001, VO = 3.3 V
Inductor Current 500 mA/div,dc
VI = 3.3 V, IO = 500 mA Timebase 500 ns/div
TPS63001, VO = 3.3 V
VI = 4.2 V, IO = 50 mA Timebase 5 ms/Div
Figure 10.
Figure 11.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
OUTPUT VOLTAGE IN POWER SAVE MODE (TPS63001, VIN < VOUT)
LOAD TRANSIENT RESPONSE (TPS63001, VIN > VOUT)
Output Voltage 100 mV/div, ac
Output Voltage 100 mV/div, ac
Inductor Current 500 mA/div, dc TPS63001, VO = 3.3 V
Output Current 200 mA/div, dc TPS63001, VO = 3.3 V
VI = 2.4 V, IO = 50 mA Timebase 5 m s/div
VI = 3.6 V, IO = 200 mA to 600 mA Timebase 2 ms/div
Figure 12. LOAD TRANSIENT RESPONSE (TPS63001, VIN < VOUT)
Figure 13. LINE TRANSIENT RESPONSE (TPS63001, Iout = 300mA)
Output Voltage 100 mV/div, ac
Output Voltage 10 mV/div,ac
Output Current 200 mA/div,dc
Input Voltage 1 V/div,dc
TPS63001, VO = 3.3 V VI = 3 V, IO = 200 mA to 600 mA Timebase 2 ms/div
TPS63001, VO = 3.3 V
VI = 3 V to 3.6 V, IO = 300 mA Timebase 2 ms/div
Figure 14.
Figure 15.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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LINE TRANSIENT RESPONSE (TPS63001, Iout = 300mA)
STARTUP AFTER ENABLE (TPS63000, VOUT = 2.5V)
Enable 2 V/div,dc Output Voltage 1 V/div,dc
Output Voltage 20 mV/div,ac
Inductor Current 200 mA/div,dc
Input Voltage 1 V/div,dc TPS63001, VO = 3.3 V VI = 3 V to 3.6 V, IO = 600 mA Timebase 2 ms/div
TPS63000, VO = 2.5 V VI = 3.3 V, IO = 300 mA Timebase 50 ms/div Voltage at L1 2 V/div, dc
Figure 16. STARTUP AFTER ENABLE (TPS63002)
Enable 2 V/div, dc Output Voltage 2 V/div, dc
Figure 17.
Inductor Current 500 mA/div, dc
TPS63002, VO = 5 V VI = 2.4 V, IO = 300 mA Timebase 100 ms/div
Voltage at L2 2 V/div,dc
Figure 18.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
PARAMETER MEASUREMENT INFORMATION
L1
L1 VIN C1 R3 VIN VINA EN C3 PS/SYNC GND
L2 VOUT R1 FB R2 PGND C2 VOUT
TPS6300X
List of Components
REFERENCE L1 C1 C2 C3 R3 R1, R2 DESCRIPTION TPS6300 0 / 1 / 2 VLF4012-2R2 10 F 6.3V, 0603, X7R ceramic 2 x 10 F 6.3V, 0603, X7R ceramic 0.1 F, X7R ceramic 100 Depending on the output voltage at TPS63000, not used at TPS6300 1 / 2 MANUFACTURER Texas Instruments TDK
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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DETAILED DESCRIPTION CONTROLLER CIRCUIT
The controlling circuit of the device is based on an average current mode topology. The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be compared with the internal reference voltage to generate a stable and accurate output voltage. The controller circuit also senses the average input current as well as the peak input current. With this, maximum input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under all possible conditions. To finally protect the device from overheating, an internal temperature sensor is implemented. Synchronous Operation The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible operating conditions. This enables the device to keep high efficency over a wide input voltage and output power range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and PGND are used. The reference for all control functions is the GND pin. The power switches are connected to PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the 4 switch topology, the load is always disconnected from the input during shutdown of the converter. Buck-Boost Operation To be able to regulate the output voltage properly at all possible input voltage conditions, the device automatically switches from step down operation to boost operation and back as required by the configuration. It always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates as a step down converter (buck) when the input voltage is higher than the output voltage, and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are permanently switching. Controlling the switches this way allows the converter to maintain high efficiency at the most important point of operation; when input voltage is close to the output voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses. Switching losses are also kept low by using only one active and one passive switch. At the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus causing no switching losses. Power Save Mode and Synchronization The PS/SYNC pin can be used to select different operation modes. To enable power save, PS/SYNC must be set low. Power save mode is used to improve efficiency at light load. If power save mode is enabled, the converter stops operating if the average inductor current gets lower than about 300 mA and the output voltage is at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage again by starting operation using a programmed average inductor current higher than required by the current load condition. Operation can last for one or several pulses. The converter again stops operating once the conditions for stopping operation are met again. The power save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The PLL can also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports standard logic thresholds.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
DETAILED DESCRIPTION (continued)
Device Enable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is disconnected from the input. This also means that the output voltage can drop below the input voltage during shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high peak currents flowing from the input. Softstart and Short Circuit Protection After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented. Thus the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output. When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output and keeps the current limit low to protect itself and the application. At a short at the output during operation the current limit also will be decreased accordingly. At 0 V at the output, for example, the output current will not exceed about 400 mA. Undervoltage Lockout An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower than approximately its threshold (see electrical characteristics table). When in operation, the device automatically enters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device automatically restarts if the input voltage recovers to the minimum operating input voltage. Overtemperature Protection The device has a built in temperature sensor which monitors the internal IC temperature. If the temperature exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
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APPLICATION INFORMATION DESIGN PROCEDURE
The TPS6300x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with a typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V . Additionally, any other voltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6300x is used.
PROGRAMMING THE OUTPUT VOLTAGE
Within the TPS6300X family there are fixed and adjustable output voltage versions available. To properly configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum recommended value for the output voltage is 5.5V. The current through the resistive divider should be about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 A, and the voltage across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended value for R2 should be lower than 500k, in order to set the divider current at 1A or higher. It is recommended to keep the value for this resistor in the range of 200k. From that, the value of the resistor connected between VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1: VOUT R 1 + R2 *1 V FB
(1)
If as an example, an output voltage of 3.3 V is needed, a 1.0 M resistor should be chosen for R1. To improve control performance using a feedforward capacitor in parallel to R1 is recommended. The value for the feedforward capacitor can be calculated using Equation 2. 2.2 ms C ff + R1 (2)
L1
L1 VIN C1 R3 VIN VINA EN C3 PS/SYNC GND
L2 VOUT R1 FB R2 PGND C2 VOUT
TPS6300X
Figure 19. Typical Application Circuit for Adjustable Output Voltage Option
INDUCTOR SELECTION
To properly configure the TPS6300X devices, an inductor must be connected between pin L1 and pin L2. To estimate the inductance value Equation 3 and Equation 4 can be used.
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TPS63000 TPS63001 TPS63002
SLVS520A - MARCH 2006 - REVISED APRIL 2006
APPLICATION INFORMATION (continued)
L1 + VOUT V IN1 Vin2 V OUT VIN1 * VOUT f 0.3 A
(3)
L2 +
VOUT * VIN2 f 0.3 A
(4)
In both equations f is the minimum switching frequency. In Equation 3 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the maximum input voltage. In Equation 4 the minimum inductance, L2, for boost mode operation is calculated. VIN2 is the minimum input voltage. The recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor for generating 3.3V from a Li-Ion battery with a battery voltage range from 2.5V up to 4.2V is 2.2 H. The recommended inductor value range is between 1.5 H and 4.7 H. In general, this means that at high voltage conversion rates, higher inductor values offer better performance. With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated. Equation 5 shows how to calculate the peak current I1 in step down mode operation and Equation 6 shows how to calculate the peak current I2 in boost mode operation.
VOUT V IN1 * V OUT I I 1 + OUT ) 0.8 2 V IN1 f L V I OUT VIN2 I 2 + OUT ) 0.8 V IN2 2 V OUT * V IN2 VOUT f L
(6)
(5)
The critical current value for selecting the right inductor is the higher value of I1 and I2. It also needs to be taken into account that load transients and error conditions may cause higher inductor currents. This also needs to be taken into account when selecting an appropriate inductor. The following inductor series from different suppliers have been used with TPS6300x converters: Table 1. List of Inductors
VENDOR Coilcraft Murata Tajo Yuden TDK INDUCTOR SERIES LPS3015 LPS4012 LQH3NP NR3015 VLF3215 VLF4012
CAPACITOR SELECTION
Input Capacitor At least a 4.7 F input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of the IC is recommended. Output Capacitor For the output capacitor, it is recommended to use small ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended. This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC. To get an estimate of the recommended minimum output capacitance, Equation 7 can be used.
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TPS63000 TPS63001 TPS63002
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C OUT + 5
L
mF mH
(7)
A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output voltage drop during load transients.
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below. * Improving the power dissipation capability of the PCB design * Improving the thermal coupling of the component to the PCB by soldering the PowerPAD * Introducing airflow in the system The maximum recommended junction temperature (TJ) of the TPS6300x devices is 125C. The thermal resistance of the 10-pin QFN 3 x 3 package (DRC) is RJA = 48.7C/W, if the PowerPAD is soldered. Specified regulator operation is assured to a maximum ambient temperature TA of 85C. Therefore, the maximum power dissipation is about 820mW, as calculated in Equation 8. More power can be dissipated if the maximum ambient temperature of the application is lower. T *T J(MAX) A P + + 125C * 85C + 820 mW D(MAX) R 48.7 C W qJA (8)
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device TPS63000DRCR TPS63000DRCRG4 TPS63001DRCR TPS63001DRCRG4 TPS63002DRCR
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SON SON SON SON SON
Package Drawing DRC DRC DRC DRC DRC
Pins Package Eco Plan (2) Qty 10 10 10 10 10 3000 Green (RoHS & no Sb/Br) 3000 TBD 3000 Green (RoHS & no Sb/Br) 3000 3000 TBD TBD
Lead/Ball Finish CU NIPDAU Call TI CU NIPDAU Call TI Call TI
MSL Peak Temp (3) Level-2-260C-1 YEAR Call TI Level-2-260C-1 YEAR Call TI Call TI
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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